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LC0408FC3.3C
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Only One Name Means ProT ek'TionTM
LC0408FC36C
LOW CAPACIT ANCE FLIP CHIP ARRA Y
APPLICA TIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Available in Voltages Ranging From 3.3V to 36V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Low Clamping Voltage Bidirectional Configuration & Monolithic Structure Protects 4 to 7 Lines LOW CAPACITANCE LOW LEAKAGE CURRENT RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0408 Weight 0.73 milligrams (Approximate) Available in Tin-Lead or Lead-Free Plating Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel Top Contacts: Solder Bump 0.004" in Height (Nominal)
0408
(Single Chip Shown)
PIN CONFIGURA TION
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DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 200 -55C to 150C -55C to 150C UNITS Watts C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 11.0 13.2 19.8 25.4 37.2 70.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 75* 10** 1 1 1 1 1 TYPICAL CAPACITANCE
V WM VOLTS LC0408FC3.3C LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC36C 3.3 5.9 8.0 12.0 15.0 24.0 36.0
@ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0
@8/20s VC @ IPP 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A
@0V, 1 MHz C pF 70 35 32 30 25 20 18
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000 200W, 8/20s Waveform 100
e-t
td = t I /2 PP
10 0.01
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
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LC0408FC36C
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20s
100 80
% Of Rated Power
60
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
5 Volts per Division
25
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 05153.R6 4/05 3 www.protekdevices.com 15 20
VC - Clamping Voltage - Volts
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LC0408FC36C
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM A B C E
SIDE
MILLIMETERS 0.56 NOM 0.86 NOM 0.99 0.0254 0.15 SQ 2.0 0.0254 0.15 NOM 0.127 MAX 0.076 MIN
INCHES 0.022 NOM 0.034 NOM 0.039 0.001 0.006 SQ 0.079 0.001 0.006 NOM 0.005 MAX 0.003 MIN 0.016 NOM
TOP
F G H
A B C G
I E F H
0.406 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002").
END
I
MOUNTING PAD LA YOUT - Option 1
DIM D C A
DIE SOLDER BUMP
PAD DIMENSIONS
MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020
A C D E F G H I
NOTE:
E
H G
1. Preferred: Using 0.1mm (0.004") stencil. I
SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK
F
Outline & Dimensions: Rev 4 - 2/04, 06021
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PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LA YOUT - Option 2
PACKAGE DIMENSIONS
DIM A F MILLIMETERS 0.51 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.006 SQ 0.028 0.039 0.020
COPPER CONTACT 0.009" [0.23] DIA.
A
DIE SOLDER BUMP
G H I
H G
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. I Outline & Dimensions: Rev 4 - 2/04, 06021
T APE & REEL ORIENT TION A
SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK
F
Quad Die - 0408 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., LC0408FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., LC0408FC05C-T75-2). 4. Suffix - LF = Lead-Free, i.e., LC0408FC05C-LF-T75-2.
COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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